SMC 2014: Materials Matter: Enabling the Future of IC Fabrication and Packaging
This year’s theme, Materials Matter—Enabling the Future of IC Fabrication and Packaging, will take a broad look at what is driving the demand for new materials, and how material suppliers are being impacted by the value chain they serve.
The semiconductor industry has reached a major inflection point: no longer is device scaling and performance driven solely by reductions in feature size. Higher device performance using less power requires the incorporation of many new materials to maintain the industry’s cadence. These material needs span across the spectrum from fabricating 3D transistor structures, to accelerating interconnect speeds, to packaging the devices in the appropriate form factors for use in phones, tablets and devices encompassing the internet of things. SMC will discuss market opportunities and examine how to win in this “Age of Materials”. The two-day conference offers presentations from leading market analysts, leading manufacturers, industry consortiums, top suppliers and academic researchers, along with an innovative interactive format designed to facilitate business contacts and networking.
Biltmore Hotel and Suites
Santa Clara, CA USA
Tuesday, September 30, 2014 to Wednesday, October 01, 2014
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