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SEMI E111-1106
| Mechanical Specification for a 150 mm Reticle SMIF Pod (RSP150) Used to Transport and Store a 6 Inch Reticle |
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SEMI E112-1106
| Mechanical Specification for a 150 mm Multiple Reticle SMIF Pod (MRSP150) Used to Transport and Store Multiple 6 Inch Reticles |
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SEMI P1-0708E
| Specification for Hard Surface Photomask Substrates |
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SEMI P2-0308
| Specification for Chrome Thin Films for Hard Surface Photomasks |
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SEMI P3-0308
| Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates |
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SEMI P5-0704
| Specification for Pellicles |
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SEMI P6-88 (Reapproved 0707)
| Specification for Registration Marks for Photomasks |
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SEMI P7-1111
| Test Method of Viscosity Determination, Method A - Kinematic Viscosity |
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SEMI P8-1111
| Test Method for the Determination of Water in Photoresist |
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SEMI P9-1111
| Guide for Functional Testing of Microelectronic Resists |
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SEMI P10-1112
| Specification of Data Structures for Photomask Orders |
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SEMI P11-0308
| Test Method for Determination of Total Normality for Alkaline Developer Solutions |
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SEMI P12-0997
| Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresists by Inductively Coupled Plasma Emission Spectroscopy (ICP) |
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SEMI P13-91 (Reapproved 1104)
| Determination of Sodium and Potassium in Positive Photoresists by Atomic Absorption Spectroscopy |
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SEMI P14-0997
| Determination of Tin in Positive Photoresists by Graphite Furnace Atomic Absorption Spectroscopy |
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SEMI P15-92 (Reapproved 1104)
| Determination of Sodium and Potassium in Positive Photoresist Metal Ion Free (MIF) Developers by Atomic Absorption Spectroscopy |
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SEMI P16-92 (Reapproved 1104)
| Determination of Tin in Positive Photoresist Metal Ion Free (MIF) Developers by Graphite Furnace Atomic Absorption Spectroscopy |
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SEMI P17-92 (Reapproved 0299)
| Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresist Metal Ion Free (MIF) Developers by Inductively Coupled Plasma Emission Spectroscopy (ICP) |
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SEMI P18-92 (Reapproved 1104)
| Specification for Overlay Capabilities of Wafer Steppers |
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SEMI P19-92 (Reapproved 0707)
| Specification for Metrology Pattern Cells for Integrated Circuit Manufacture |
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SEMI P20-0703
| Guideline for Catalog Publication of EB Resist Parameters (Proposal) |
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SEMI P21-92 (Reapproved 0703)
| Guidelines for Precision and Accuracy Expression for Mask Writing Equipment |
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SEMI P22-0307
| Guideline for Photomask Defect Classification and Size Definition |
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SEMI P23-0200 (Reapproved 1107)
| Guidelines for Programmed Defect Masks and Benchmark Procedures for Sensitivity Analysis of Mask Defect Inspection Systems |
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SEMI P24-94 (Reapproved 1104)
| CD Metrology Procedures |
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SEMI P25-94 (Reapproved 1104)
| Specification for Measuring Depth of Focus and Best Focus |
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SEMI P26-0703
| Parameter Checklist for Photoresist Sensitivity Measurement |
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SEMI P27-96 (Reapproved 0703)
| Parameter Checklist for Resist Thickness Measurement on a Substrate |
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SEMI P28-96 (Reapproved 0707)
| Specification for Overlay-Metrology Test Patterns for Integrated-Circuit Manufacture |
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SEMI P29-1111
| Specification for Characteristics Specific to Attenuated Phase Shift Masks and Masks Blanks |
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SEMI P30-0997 (Reapproved 1104)
| Practice for Catalog Publication of Critical Dimension Measurement Scanning Electron Microscopes (CD-SEM) |
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SEMI P31-0304 (Reapproved 0611)
| Practice for Catalog Publication for Chemical Amplified (CA) Photoresist Parameter |
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SEMI P32-1104
| Test Method for Determination of Trace Metals in Photoresist |
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SEMI P34-0200 (Reapproved 0707)
| Specification for 230 mm Square Photomask Substrates |
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SEMI P35-1106
| Terminology for Microlithography Metrology |
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SEMI P36-1108
| Guide for Magnification Reference for Critical Dimension Measurement Scanning Electron Microscopes (CD-SEM) |
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SEMI P37-1109
| Specification for Extreme Ultraviolet Lithography Substrates and Blanks |
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SEMI P39-0308
| OASIS (TM) - Open Artwork System Interchange Standard |
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SEMI P40-1109
| Specification for Mounting Requirements for Extreme Ultraviolet Lithography Masks |
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SEMI P41-0304E
| Specification for Mask Defect Data Handling with XML, Between Defect Inspection Tools, Repair Tools, and Review Tools |
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SEMI P42-0304
| Specification of Reticle Data for Automatic Recipe Transfer to Wafer Exposure System |
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SEMI P43-0304 (Reapproved 0611)
| Photomask Qualification Terminology |
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SEMI P44-0211
| Specification for Open Artwork System Interchange Standard (OASIS ®) Specific to Mask Tools |
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SEMI P45-0211
| Specification for Job Deck Data Format for Mask Tools |
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SEMI P46-1111
| Specification for Critical Dimension (CD) Measurement Information Data on Photomask by XML |
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SEMI P47-0307 (Reapproved 0513)
| Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness |
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SEMI P48-1110
| Specification of Fiducial Marks for EUV Mask Blank |