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MEMS

 
. SEMI MS1-0812 Guide to Specifying Wafer-Wafer Bonding Alignment Targets
. SEMI MS2-1113 Test Method for Step Height Measurements of Thin Films
. SEMI MS3-0307 Terminology for MEMS Technology
. SEMI MS4-1113 Standard Test Method for Young's Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in Resonance
. SEMI MS5-0813 Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures
. SEMI MS6-0308 Guide for Design and Materials for Interfacing Microfluidic Systems
. SEMI MS7-0708 Specification for Microfluidic Interfaces to Electronic Device Packages
. SEMI MS8-0309 Guide to Evaluating Hermeticity of MEMS Packages
. SEMI MS9-0611 Specification for High Density Permanent Connections Between Microfluidic Devices
. SEMI MS10-0912 Test Method to Measure Fluid Permeation Through MEMS Packaging Materials