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SEMI MS1-0812
| Guide to Specifying Wafer-Wafer Bonding Alignment Targets |
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SEMI MS2-0212
| Test Method for Step Height Measurements of Thin Films |
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SEMI MS3-0307
| Terminology for MEMS Technology |
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SEMI MS4-0212
| Standard Test Method for Young's Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in Resonance |
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SEMI MS5-1211
| Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures |
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SEMI MS6-0308
| Guide for Design and Materials for Interfacing Microfluidic Systems |
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SEMI MS7-0708
| Specification for Microfluidic Interfaces to Electronic Device Packages |
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SEMI MS8-0309
| Guide to Evaluating Hermeticity of MEMS Packages |
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SEMI MS9-0611
| Specification for High Density Permanent Connections Between Microfluidic Devices |
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SEMI MS10-0912
| Test Method to Measure Fluid Permeation Through MEMS Packaging Materials |