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SEMI G1-96
| Specification for Cerdip Package Constructions |
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SEMI G2-94
| Specification for Metallic Leadframes for Cer-Dip Packages |
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SEMI G3-90
| Specification for Sidebrazed Laminates |
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SEMI G4-0302 (Reapproved 0811)
| Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes |
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SEMI G5-87
| Standard for Ceramic Chip Carriers |
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SEMI G6-89
| Test Method for Seal Ring Flatness |
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SEMI G8-94 (Reapproved 0811)
| Test Method for Gold Plating |
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SEMI G9-89
| Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages |
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SEMI G10-96 (Reapproved 0811)
| Standard Method for Mechanical Measurement of Plastic Package Leadframes |
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SEMI G11-88 (Reapproved 0811)
| Recommended Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds |
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SEMI G13-88 (Reapproved 0811)
| Standard Test Method for Expansion Characteristics of Molding Compounds |
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SEMI G14-88
| Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling |
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SEMI G15-93 (Reapproved 0811)
| Standard Test Method for Differential Scanning Calorimetry of Molding Compounds |
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SEMI G16-88
| Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling |
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SEMI G18-96 (Reapproved 0811)
| Standard for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes |
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SEMI G19-0997 (Reapproved 0811)
| Specification for Dip Leadframes Produced by Etching |
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SEMI G20-96
| Specification for Lead Finishes for Plastic Packages (Active Devices Only) |
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SEMI G21-94
| Specification for Plating Integrated Circuit Leadframes |
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SEMI G22-1296
| Specification for Ceramic Pin Grid Array Packages |
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SEMI G23-0996 (Reapproved 0811)
| Test Method of Inductance for Internal Traces of Semiconductor Packages |
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SEMI G24-89 (Reapproved 0811)
| Test Method for Measuring the Lead-to-Lead and Loading Capacitance of Package Leads |
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SEMI G25-89 (Reapproved 0811)
| Test Method for Measuring the Resistance of Package Leads |
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SEMI G26-90
| Specification for Hermetic Slam Chip Carrier Lids |
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SEMI G27-89
| Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages |
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SEMI G28-0997 (Reapproved 0811)
| Specification for Leadframes for Plastic Molded S.O. Packages |
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SEMI G29-1296E (Reapproved 0811)
| Test Method for Trace Contaminants in Molding Compounds |
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SEMI G30-88 (Reapproved 0811)
| Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages |
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SEMI G31-0997
| Test Method for Determining the Abrasive Characteristics of Molding Compounds |
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SEMI G32-94 (Reapproved 0811)
| Guideline for Unencapsulated Thermal Test Chip |
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SEMI G33-90
| Specification for Pressed Ceramic Pin Grid Array Packages |
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SEMI G34-89
| Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users |
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SEMI G35-87
| Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices |
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SEMI G36-88
| Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling |
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SEMI G37-88
| Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling |
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SEMI G38-0996 (Reapproved 0811)
| Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages |
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SEMI G39-89
| Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly |
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SEMI G41-87
| Specification for Dual Strip SOIC Leadframe |
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SEMI G42-0996 (Reapproved 0811)
| Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages |
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SEMI G43-87 (Reapproved 0811)
| Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages |
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SEMI G44-94
| Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only) |
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SEMI G45-93
| Recommended Practice for Flash Characteristics of Thermosetting Molding Compounds |
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SEMI G46-88
| Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits |
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SEMI G47-88
| Specification for Plastic Molded Quad Flat Pack Leadframes |
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SEMI G48-89
| Specification for Measurement Method for Molded Plastic Package Tooling |
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SEMI G49-93
| Specification for Plastic Molding Preforms |
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SEMI G50-89
| Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions |
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SEMI G51-90 (Reapproved 0811)
| Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes |
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SEMI G52-90 (Reapproved 1104)
| Standard Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes (Proposed) |
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SEMI G53-92
| Specification for Metal Lid/Preform Assembly |
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SEMI G54-93
| Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages |
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SEMI G55-93 (Reapproved 0811)
| Test Method for Measurement of Silver Plating Brightness |
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SEMI G56-93 (Reapproved 0811)
| Test Method for Measurement of Silver Plating Thickness |
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SEMI G57-0302
| Guideline for Standardization of Leadframe Terminology |
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SEMI G58-94 (Reapproved 0811)
| Specification for Cerquad Package Constructions |
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SEMI G59-94 (Reapproved 0811)
| Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes |
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SEMI G60-94 (Reapproved 0811)
| Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials |
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SEMI G61-94
| Specification for Cofired Ceramic Packages |
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SEMI G62-95 (Reapproved 0811)
| Test Method for Silver Plating Quality |
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SEMI G63-95 (Reapproved 0811)
| Test Method for Measurement of Die Shear Strength |
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SEMI G64-96 (Reapproved 0811)
| Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) |
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SEMI G65-96 (Reapproved 0811)
| Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages |
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SEMI G66-96 (Reapproved 0811)
| Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds |
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SEMI G67-0996 (Reapproved 0811)
| Test Method for the Measurement of Particle Generation from Sheet Materials |
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SEMI G68-0996 (Reapproved 0811)
| Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages |
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SEMI G69-0996 (Reapproved 0811)
| Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds |
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SEMI G70-0996 (Reapproved 0811)
| Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes |
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SEMI G71-0996 (Reapproved 0811)
| Specification for Barcode Marking of Intermediate Containers for Packaging Materials |
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SEMI G72-0997 (Reapproved 0811)
| Specification for Ball Grid Array Design Library |
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SEMI G73-0997 (Reapproved 0811)
| Test Method for Pull Strength for Wire Bonding |
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SEMI G74-0699 (Reapproved 0706)
| Specification for Tape Frame for 300 mm Wafers |
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SEMI G75-0698 (Reapproved 0706)
| Standard Test Method of the Properties of Leadframe Tape |
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SEMI G76-0299 (Reapproved 0706)
| Specification for Polyimide-Based Adhesive Tape Used in Tape Carrier Packages (TCP) |
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SEMI G77-0699 (Reapproved 0706)
| Specification for Frame Cassette for 300 mm Wafers |
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SEMI G78-0699 (Withdrawn 1011)
| Test Method for Comparing Automated Wafer Probe Systems Utilizing Process-Specific Measurements |
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SEMI G79-0200 (Reapproved 0512)
| Specification for Overall Digital Timing Accuracy |
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SEMI G80-0200 (Reapproved 0612)
| Test Method for the Analysis of Overall Digital Timing Accuracy for Automated Test Equipment |
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SEMI G81-0307
| Specification for Map Data Items |
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SEMI G82-0301E (Reapproved 0706)
| Provisional Specification for 300 mm Load Port for Frame Cassettes in Backend Process |
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SEMI G83-0912
| Specification for Bar Code Marking of Product Packages |
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SEMI G84-0303
| Specification for Strip Map Protocol |
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SEMI G85-0703
| Specification for Map Data Format |
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SEMI G86-0303 (Reapproved 0811)
| Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending |
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SEMI G87-1108
| Specification for Plastic Tape Frame for 300 mm Wafer |
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SEMI G88-0211
| Specification for Tape Frame for 450 mm Wafer |
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SEMI G89-0211
| Specification for Leadframe Strip Size |
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SEMI G90-0811
| Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes |
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SEMI G91-0513
| Standard Test Data Format (STDF) Memory Fail Datalog |
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SEMI G92-0412
| Specification for Tape Frame Cassette for 450 mm Wafer |
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SEMI G93-0412
| Measurement Method for Solder Sphere Size for Ball Grid Array Package |
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SEMI G94-0113
| Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer |