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SEMI M74-1108 - Specification for 450 mm Diameter Mechanical Handling Polished Wafers

Volume(s): Materials
Language: English
Type: Single Standards Download (.pdf)
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Status
SUPERSEDED - Replaced by a newer version.


Abstract

This standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on August 29, 2008. It was available at www.semi.org in October 2008.

 

This document specifies 450 mm diameter mechanical handling wafers intended for use in research, development and early design investigation of 450 mm semiconductor equipment such as 450 mm wafers, carriers, load ports, AMHS, and robotics.


Referenced SEMI Standards

SEMI M1 — Specifications for Polished Monocrystalline Silicon Wafers
SEMI M20 — Practice for Establishing a Wafer Coordinate System
SEMI M59 — Terminology for Silicon Technology
SEMI MF533 — Test Method for Thickness and Thickness Variation of Silicon Wafers
SEMI MF928 — Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates
SEMI MF1152 — Test Method for Dimensions of Notches on Silicon Wafers
SEMI MF1390 — Test Method for Measuring Warp on Silicon Wafers by Automated Non-Contact Scanning
SEMI MF1451 — Test Method for Measuring Sori on Silicon Wafers by Automated Non-Contact Scanning
SEMI MF1530 — Test Method for Measuring Flatness, Thickness, and Total Thickness Variation on Silicon Wafers by Automated Non-Contact Scanning
SEMI T3 — Specification for Wafer Box Labels
SEMI T7 — Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol


Revision History
SEMI M74-1108 (first published)


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