This standard was technically approved by the global Assembly & Packaging
Committee. This edition was approved for publication by the global Audits &
Reviews Subcommittee on August 29, 2008. It was available at www.semi.org in
The purpose of this document is to standardize the specification of a plastic
tape frame, for a 300 mm wafer, which is used between the dicing process and the
die bonding process, and for the handling and shipping of wafers.