Welcome to SEMI

SEMI International Standards

SEMI G87-1108 - Specification for Plastic Tape Frame for 300 mm Wafer

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
SEMI Standards Copyright Policy/License Agreements
Bookmark and Share
 
$150.00



Status
CURRENT - Supported by the technical committee.


Abstract

This standard was technically approved by the global Assembly & Packaging Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on August 29, 2008. It was available at www.semi.org in October 2008.

 

The purpose of this document is to standardize the specification of a plastic tape frame, for a 300 mm wafer, which is used between the dicing process and the die bonding process, and for the handling and shipping of wafers.


Referenced SEMI Standards

None.


Revision History
SEMI G87-1108 (first published)


Related Products
Need Access to all SEMI Standards?
Check out SEMIViews our web-based APP.