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SEMI Downloads
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Volumes(s): Packaging
Language: English
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SEMI G87-1108 - Specification for Plastic Tape Frame for 300 mm Wafer |
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SEMI Standards Copyright Policy/License Agreements |
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Status |
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CURRENT - Supported by the technical committee. |
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Abstract |
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This standard was technically approved by the global Assembly & Packaging
Committee. This edition was approved for publication by the global Audits &
Reviews Subcommittee on August 29, 2008. It was available at www.semi.org in
October 2008.
The purpose of this document is to standardize the specification of a plastic
tape frame, for a 300 mm wafer, which is used between the dicing process and the
die bonding process, and for the handling and shipping of wafers.
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Referenced SEMI Standards |
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None.
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Revision History: |
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SEMI G87-1108 (first published) |
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