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SEMI G87-1108 - Specification for Plastic Tape Frame for 300 mm Wafer

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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SUPERSEDED - Replaced by a newer version.


This standard was technically approved by the global Assembly & Packaging Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on August 29, 2008. It was available at www.semi.org in October 2008.


The purpose of this document is to standardize the specification of a plastic tape frame, for a 300 mm wafer, which is used between the dicing process and the die bonding process, and for the handling and shipping of wafers.

Referenced SEMI Standards


Revision History
SEMI G87-1108 (first published)

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