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SEMI Downloads
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Volumes(s): Packaging
Language: English
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SEMI G77-0699 (Reapproved 0706) - Specification for Frame Cassette for 300 mm Wafers |
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SEMI Standards Copyright Policy/License Agreements |
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Status |
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CURRENT - Supported by the technical committee. |
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Abstract |
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This standard was technically approved by the global Assembly & Packaging
Committee. This edition was approved for publication by the global Audits &
Reviews Subcommittee on May 16, 2006. It was available at www.semi.org in June
2006. Originally published June 1999.
The purpose of this document is to specify the mechanical features for a 300
mm wafer frame cassette used between the wafer mounting process and the
die-bonding process. |
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Referenced SEMI Standards |
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SEMI E1.9 — Provisional Mechanical Specification for Cassettes Used to
Transport and Store 300 mm Wafers
SEMI E15 — Specification for Tool Load Port
SEMI E47.1 — Provisional Mechanical Specification for Boxes and Pods Used to
Transport and Store 300 mm Wafers |
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Revision History: |
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SEMI G77-0699 (Reapproved 0706)
SEMI G77-0699 (first published) |
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