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SEMI G77-0699 (Reapproved 0706) - Specification for Frame Cassette for 300 mm Wafers

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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This standard was technically approved by the global Assembly & Packaging Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on May 16, 2006. It was available at www.semi.org in June 2006. Originally published June 1999.


The purpose of this document is to specify the mechanical features for a 300 mm wafer frame cassette used between the wafer mounting process and the die-bonding process.

Referenced SEMI Standards

SEMI E1.9 — Provisional Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers

SEMI E15 — Specification for Tool Load Port

SEMI E47.1 — Provisional Mechanical Specification for Boxes and Pods Used to Transport and Store 300 mm Wafers

Revision History

SEMI G77-0699 (Reapproved 0706)

SEMI G77-0699 (first published)

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