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SEMI Downloads
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Volumes(s): Packaging
Language: English
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SEMI G74-0699 (Reapproved 0706) - Specification for Tape Frame for 300 mm Wafers |
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SEMI Standards Copyright Policy/License Agreements |
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Status |
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CURRENT - Supported by the technical committee. |
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Abstract |
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This standard was technically approved by the global Assembly & Packaging
Committee. This edition was approved for publication by the global Audits &
Reviews Subcommittee on May 16, 2006. It was available at www.semi.org in June
2006. Originally published June 1998; previously published June 1999.
The purpose of this document is to standardize the specifications for 300 mm
wafer tape frames used between the dicing process and the die-bonding process.
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Referenced SEMI Standards |
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None.
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Revision History: |
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SEMI G74-0699 (Reapproved 0706)
SEMI G74-0699 (technical revision)
SEMI G74-0998 (technical revision)
SEMI G74-0698 (first published) |
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