This standard was technically approved by the global Assembly & Packaging
Committee. This edition was approved for publication by the global Audits &
Reviews Subcommittee on May 16, 2006. It was available at www.semi.org in June
2006. Originally published June 1998; previously published June 1999.
The purpose of this document is to standardize the specifications for 300 mm
wafer tape frames used between the dicing process and the die-bonding process.
SEMI G74-0699 (Reapproved 0706)
SEMI G74-0699 (technical revision)
SEMI G74-0998 (technical revision)
SEMI G74-0698 (first published)