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SEMI G74-0699 (Reapproved 0706) - Specification for Tape Frame for 300 mm Wafers

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Status
CURRENT - Supported by the technical committee.


Abstract

This standard was technically approved by the global Assembly & Packaging Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on May 16, 2006. It was available at www.semi.org in June 2006. Originally published June 1998; previously published June 1999.

 

The purpose of this document is to standardize the specifications for 300 mm wafer tape frames used between the dicing process and the die-bonding process.


Referenced SEMI Standards

None.


Revision History

SEMI G74-0699 (Reapproved 0706)

SEMI G74-0699 (technical revision)

SEMI G74-0998 (technical revision)

SEMI G74-0698 (first published)


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