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SEMI HB2-0613 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices

Volume(s): HB-LED
Language: English
Type: Single Standards Download (.pdf)
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CURRENT - Supported by the technical committee.


This Standard was technically approved by the HB-LED Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on June 4, 2013. Available at www.semiviews.org and www.semi.org in June 2013.


This Specification provides the dimensional requirements for plastic and metal wafer cassettes used for the processing and handling of 150 mm diameter HB-LED sapphire wafers conforming to the SEMI standard.


This Specification is for general usage and outlines the basic requirements for open cassettes for 150 mm sapphire wafer sizes.


This Document provides basic interface requirements for automated substrate handling.


To meet these specifications, cassettes must be manufactured within the dimensional limits and be dimensionally stable within the specification when used in accordance with manufacturers’ recommendations.

Referenced SEMI Standards

SEMI HB1 — Specifications for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices

Revision History

SEMI HB2-0613 (first published)

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