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SEMI 3D1-0912 - Terminology for Through Silicon via Geometrical Metrology

Volume(s): 3D-IC
Language: English
Type: Single Standards Download (.pdf)
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Status
CURRENT - Supported by the technical committee.


Abstract

This Standard was technically approved by the global 3DS-IC Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 30, 2012. Available at www.semiviews.org and www.semi.org in September 2012.

 

Clear and commonly accepted definitions are needed for efficient communication and to prevent misunderstanding between buyers and vendors of metrology equipment and manufacturing services. The purpose of this Document is to provide a consistent terminology for the understanding and discussion of metrology issues important to through silicon vias (TSV).


Referenced SEMI Standards

SEMI E89 — Guide for Measurement System Analysis (MSA)

SEMI P35 — Terminology for Microlithography Metrology


Revision History

SEMI 3D1-0912 (first published)


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