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SEMI MS1-0812 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets

Volume(s): MEMS
Language: English
Type: Single Standards Download (.pdf)
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Status
CURRENT - Supported by the technical committee.


Abstract

This Standard was technically approved by the global MEMS Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on June 18, 2012. Available at www.semiviews.org and www.semi.org in August 2012; originally published March 2006; previously published March 2007.

 

NOTICE: This Document was reapproved with minor editorial changes.

 

This Guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together.


Referenced SEMI Standards

SEMI M20 — Practice for Establishing a Wafer Coordinate System


Revision History

SEMI MS1-0307 (Reapproved 0812)

SEMI MS1-0307 (technical revision)

SEMI MS1-0306 (first published)


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