This Standard was technically approved by the global
Assembly & Packaging Technical Committee. This edition was approved for
publication by the global Audits and Reviews Subcommittee on February 21, 2012.
Available at www.semiviews.org and www.semi.org in April 2012.
The purpose of this Standard is to specify mechanical
features for the 450 mm wafer tape frame cassette used between the wafer
mounting process and the die-bonding
SEMI G88 —
Specification for Tape Frame for 450 mm Wafer