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SEMI G92-0412 - Specification for Tape Frame Cassette for 450 mm Wafer

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Status
SUPERSEDED - Replaced by a newer version.


Abstract

This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on February 21, 2012. Available at www.semiviews.org and www.semi.org in April 2012.

 

The purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die-bonding process.


Referenced SEMI Standards

SEMI G88 — Specification for Tape Frame for 450 mm Wafer


Revision History

SEMI G92-0412 (first published)


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