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SEMI G92-0412 - Specification for Tape Frame Cassette for 450 mm Wafer
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Status
CURRENT - Supported by the technical committee.

Abstract

This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on February 21, 2012. Available at www.semiviews.org and www.semi.org in April 2012.

 

The purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die-bonding process.


Referenced SEMI Standards
 

SEMI G88 — Specification for Tape Frame for 450 mm Wafer


Revision History:
 

SEMI G92-0412 (first published)