This Standard was technically approved by the global Photovoltaic Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on September 12, 2011. Available at www.semiviews.org and www.semi.org in October 2011.

This Specification covers the requirements for silicon wafers for use in photovoltaic (PV) solar cell manufacture. To permit common processing equipment to be used in multiple fabrication lines, it is essential for the wafer dimensions to be standardized.

This Specification provides standardized dimensional and certain other common characteristics of silicon wafers based on currently widely used sizes for photovoltaic applications.

This Specification also provides a tabular specification format for order entry so that relevant nonstandardized wafer characteristics and extensions of wafer sizes for research, development, and new requirements can be easily and consistently specified in commercial transactions.

SEMI M35 — Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection

SEMI M44 — Guide to Conversion Factors for Interstitial Oxygen in Silicon

SEMI M53 — Practice for Calibrating Scanning Surface Inspection Systems Using Depositions of Monodisperse Polystyrene Latex Sphere on Unpatterned Semiconductor Wafer Surfaces

SEMI M58 — Test Method for Evaluating DMA-Based Particle Deposition Systems and Processes

SEMI M59 — Terminology for Silicon Technology

SEMI MF26 — Test Methods for Determining the Orientation of a Semiconductive Single Crystal

SEMI MF42 — Test Methods for Conductivity Type of Extrinsic Semiconducting Materials

SEMI MF84 — Test Method for Measuring Resistivity of Silicon Wafers with an In-Line Four-Point Probe

SEMI MF391 — Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-State Surface Photovoltage

SEMI MF533 — Test Method for Thickness and Thickness of Variation of Silicon Wafers

SEMI MF657 — Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning

SEMI MF673 — Test Methods for Measuring Resistivity of Semiconductor Wafers or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gage

SEMI MF847 — Test Methods for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques

SEMI MF978 — Test Method for Characterizing Semiconductor Deep Levels by Transient Capacitance Techniques

SEMI MF1617 — Test Method for Measuring Surface Sodium, Aluminum, Potassium, and Iron on Silicon and Epi Substrates by Secondary Ion Mass Spectrometry

SEMI MF1810 — Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers

SEMI MF1982 — Test Methods for Analyzing Organic Contaminants on Silicon Wafer Surfaces by Thermal Desorption Gas Chromatography

SEMI PV1 — Test Method for Measuring Trace Elements in Silicon Feedstock for Silicon Solar Cells by High-Mass Resolution Glow Discharge Mass Spectrometry

SEMI PV9 — Test Method for Excess Charge Carrier Decay in PV Silicon Materials by Non-Contact Measurements of Microwave Reflectance After a Short Illumination Pulse

SEMI PV13 — Test Method for Contactless Excess-Charge-Carrier Recombination Lifetime Measurement in Silicon Wafers, Ingots, and Bricks Using an Eddy-Current Sensor

SEMI PV22-1011 (first published)