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SEMI Downloads
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Volumes(s): Packaging
Language: English
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SEMI G88-0211 - Specification for Tape Frame for 450 mm Wafer |
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SEMI Standards Copyright Policy/License Agreements |
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Status |
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CURRENT - Supported by the technical committee. |
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Abstract |
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This Standard was technically approved by the global Assembly & Packaging
Committee. This edition was approved for publication by the global Audits &
Reviews Subcommittee on December 21, 2010. Available at www.semiviews.org and www.semi.org in February 2011.
The purpose of this document is to standardize the
specifications for 450 mm wafer tape frames used between the dicing process and
the die-bonding process and also used for shipping and handling.
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Referenced SEMI Standards |
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None.
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Revision History: |
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SEMI G88-0211 (first published)
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