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SEMI G88-0211 - Specification for Tape Frame for 450 mm Wafer

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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CURRENT - Supported by the technical committee.


This Standard was technically approved by the global Assembly & Packaging Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on December 21, 2010. Available at www.semiviews.org and www.semi.org in February 2011.

The purpose of this document is to standardize the specifications for 450 mm wafer tape frames used between the dicing process and the die-bonding process and also used for shipping and handling.

Referenced SEMI Standards


Revision History

SEMI G88-0211 (first published)

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