This Standard was technically approved by the global Assembly & Packaging
Committee. This edition was approved for publication by the global Audits &
Reviews Subcommittee on December 21, 2010. Available at www.semiviews.org and www.semi.org in February 2011.
The purpose of this document is to standardize the
specifications for 450 mm wafer tape frames used between the dicing process and
the die-bonding process and also used for shipping and handling.
SEMI G88-0211 (first published)