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SEMI E1-1110 - Specification for Open Plastic and Metal Wafer Carriers

Volume(s): Equipment Automation Hardware
Language: English
Type: Single Standards Download (.pdf)
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This standard was technically approved by the global Physical Interfaces & Carriers Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on August 27, 2010. Initially available at www.semi.org in October 2010. Originally published in 1979; previously published March 2010.


This specification provides the dimensional requirements for plastic and metal wafer carriers used for the processing and handling of 3 inch, 100 mm, 125 mm and 150 mm diameter wafers. It also includes some related information on, but not a specification for, 200 mm diameter wafer carriers.


The specification has two classifications: General Usage and Auto Transport Usage.

General Usage is a basic guideline that covers 3 inch, 100 mm, 125 mm, and 150 mm wafer sizes.

Auto Transport Usage is intended to meet the in-use requirements for the interface of wafer carriers with automated wafer processing equipment. Auto Transport Usage covers the 125 mm wafer size.

There is some related information (of historical interest, but not part of the requirements) on the 200 mm wafer size.


To meet these specifications, carriers must be manufactured within the dimensional limits and be dimensionally stable within the specification when used in accordance with manufacturers’ recommendations.

Referenced SEMI Standards


Revision History

SEMI E1-1110 (technical revision)

SEMI E1-0310 (complete rewrite)

SEMI E1-0697 (Reapproved 1102)E (editorial revision)

SEMI E1-0697 (Reapproved 1102)

SEMI E1-0697 (technical revision)

SEMI E1-78 (first published)

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