This standard was technically approved by the global Silicon Wafer Committee.
This edition was approved for publication by the global Audits & Reviews
Subcommittee on April 30, 2010. Initially available at www.semi.org in June
The developmental wafers covered by this specification
are intended for use in research and development of process and metrology equipment
and fabrication processes required for manufacturing high-density integrated circuits on
450 mm diameter single crystal silicon wafers. They can also be used to establish
the techniques and metrology necessary to support a dimensional specification
for 450 mm diameter circuit-quality (prime) wafers.