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SEMI T7-0303 (Reapproved 0709) - Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol

Volume(s): Traceability
Language: English
Type: Single Standards Download (.pdf)
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This standard was technically approved by the global Traceability Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 13, 2009. It was available at www.semi.org in June 2009. Originally published in 1997; previously published March 2003.


This specification is intended to provide a marking symbology that can be used to mark silicon wafers with no intrusion into the fixed quality area of the wafer.


This specification defines the geometric and spatial relationships and content (including the error checking and correcting code) of a rectangular two-dimensional (2-D), machine-readable, binary data matrix code symbol for back surface marking of notched, double-side polished wafers of silicon which comply with SEMI M1.15, and other materials with diameters of 300 mm and larger.


Although this specification does not specify the marking techniques that may be employed when complying with its requirements, it is assumed that the symbol will be obtained by laser scribing individual dots.


The matrix code is applicable to a broad range of wafer products including epitaxial wafers, SOI wafers, and unpatterned or patterned polished wafers. The format and algorithms of this code are based on two-dimensional symbology specified in ISO/IEC 16022.

Referenced SEMI Standards
SEMI M1.15 — Standard for 300 mm Polished Monocrystalline Silicon Wafers (Notched)

Revision History

SEMI T7-0303 (Reapproved 0709)

SEMI T7-0303 (technical revision)

SEMI T7-1102 (technical revision)

SEMI T7-0302 (technical revision)

SEMI T7-0997E3 (editorial revision)

SEMI T7-0997E2 (editorial revision)

SEMI T7-0997E (editorial revision)

SEMI T7-0997 (first published)

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