This standard was technically approved by the global Physical Interfaces & Carriers Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on January 2, 2009. It was available at www.semi.org in February 2009. Originally published in 1991; previously published November 2002.

The purpose of the standard is to simplify cluster tool implementation in the fab. Equipment suppliers are required to provide modules that can be connected into any cluster tool using the specifications contained herein. Process and cassette modules accept wafers at locations that may vary substantially from one module to another. This places a burden on the capabilities of transport modules to move wafers to and from various modules in a cluster tool. This specification defines wafer transport planes within cassette and process modules. This obviates the wafer transport problem to a large extent, but does not unduly restrict module content.

Subordinate Document:

SEMI E21.1-0309 — Cluster Tool Module Interface 300 mm: Mechanical Interface and Wafer Transport Standard

None.

SEMI E21-94 (Reapproved 0309)

SEMI E21-94 (Reapproved 1102)

SEMI E21-94 (Reapproved 0699)

SEMI E21-94 (technical revision)

SEMI E21-91 (first published)

SEMI E21.1-0309 (technical revision)

SEMI E21.1 -1296 (Reapproved 1102)

SEMI E21.1-1296 (technical revision)

SEMI E21.1-92 (first published)