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SEMI MS1-0307 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets

Volume(s): MEMS
Language: English
Type: Single Standards Download (.pdf)
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This standard was technically approved by the global MEMS Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on November 21, 2006. It was available at www.semi.org in February 2007. Originally published in March 2006.


This guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together.

Referenced SEMI Standards
SEMI M20 — Practice for Establishing a Wafer Coordinate System

Revision History

SEMI MS1-0307 (technical revision)

SEMI MS1-0306 (first published)

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