was technically approved by the global MEMS Committee. This edition was approved
for publication by the global Audits & Reviews Subcommittee on November 21,
2006. It was available at www.semi.org in February 2007. Originally published in
provides a framework for specifying the dimensions, location, quantity and
characteristics of alignment targets that are placed on each wafer of a pair of
wafers. Such targets are used to align two patterned wafers prior to an
operation that bonds them together.