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SEMI Downloads
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Volumes(s): MEMS
Language: English
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SEMI MS1-0307 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets |
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SEMI Standards Copyright Policy/License Agreements |
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Status |
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SUPERSEDED - Replaced by a newer version. |
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Abstract |
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This standard
was technically approved by the global MEMS Committee. This edition was approved
for publication by the global Audits & Reviews Subcommittee on November 21,
2006. It was available at www.semi.org in February 2007. Originally published in
March 2006.
This guide
provides a framework for specifying the dimensions, location, quantity and
characteristics of alignment targets that are placed on each wafer of a pair of
wafers. Such targets are used to align two patterned wafers prior to an
operation that bonds them together.
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Referenced SEMI Standards |
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SEMI M20 —
Practice for Establishing a Wafer Coordinate System
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Revision History: |
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SEMI MS1-0307
(technical revision)
SEMI MS1-0306
(first published) |
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