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SEMI G92-1113 - Specification for Tape Frame Cassette for 450 mm Wafer

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 22, 2013. Available at www.semiviews.org and www.semi.org in November 2013; originally published April 2012.


The purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die-bonding process.


This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces.


Only the mechanical interfaces for the tape frame cassette are specified. Materials kinds or cleanliness are not defined.


This Standard specifies both semi-automated (PGV) and automated (AGV or OHT) handling of the tape frame cassette for 450 mm wafer. It does not intend to address manual handling.


A 450 mm wafer frame cassette has the following components and optional components. Optional components are not required features for the 450 tape frame cassette (TFC). They can be added according to customers’ demands or manufacturing problems.



  • Top cover (optional)

  • Automation flange (optional)



  • Frame supports for 13 or 25 tape frames

  • Tape frame restraint



  • Corresponds to the forklift handling



  • Rear cover (optional)

  • Label placement area (optional)



  • Three features that mate with kinematic coupling pins

  • Six frame cassette sensing pads

  • Tape frame release bar (optional)

Referenced SEMI Standards

SEMI G88 — Specification for Tape Frame for 450 mm Wafer

Revision History

SEMI G92-1113 (technical revision)

SEMI G92-0412 (first published)

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